Stipend Notes
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December 1, 2024
University of South Alabama
Mitsubishi Polysilicon Endowed Scholarship
Description
This scholarship was established for the purpose of providing financial assistance to a current junior or senior student majoring in the College of Engineering with a minimum 3.0 GPA.
Eligibility
- current junior or senior student majoring in the College of Engineering with a minimum 3.0 GPA.
- To apply for this scholarship please complete the Undergraduate Engineering Application.
Majors
Minorities
Special Categories
Mobile, AL